Circuit Formation Materials｜SEMICONDUCTOR MATERIALS

Circuit Formation Materials

Cu etchant for subtractive process
Our Cu etchant for subtractive process enables stable etching by using the automatic control equipment “AFES controller”. In order to maintain a constant concentration of the etching solution, it automatically analyzes the etching solution at all times and automatically replenishes etching make-up solution and water according to the ORP (oxidation-reduction potential), ion index (free acid concentration) and specific gravity. This results in stable production of fine patterns, a significant reduction in defective rates, and improved productivity. Additionally, it is possible to control the hydrochloric acid concentration at 0.6% or less.

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Cu etchant for subtractive process

Metal film remover for tools
In the pre-treatment process for recoating cutting tools, jigs, and molds, residual coating film can be removed simply by dipping them in our metal film remover for tools. It is an alkaline/hydrogen peroxide-based solution.

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Titanium remover：TITAPEEL A/B series

Resist remover
Our resist remover is a concentrated, one-liquid type that can remove dry film resist, liquid resist, and screen printing resist by pulverizing them into small particles while suppressing metal corrosion.

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ADEKA REMOVER RA-600

Non-roughening adhesion improver for high frequency applications
In order to realize next-generation high-speed communications that use high-frequency bands, it is essential to reduce the transmission loss of the constituent materials. Generally, the copper surface needs to be roughened to ensure adhesion between the copper and resin, but our non-roughening adhesion improver improves the adhesion between the copper and resin without roughening the copper surface, making it possible to reduce transmission loss. In addition, because of non-roughening, there is no reduction in the copper film thickness, therefore fine pitch patterning is expected.

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STA series