Circuit Formation, Packaging Materials
Etching Materials《Control System》
| PRODUCT NAME | USE |
|---|---|
| ADEKA AFES | Automatic etching agent control device |
| ADEKA AFES SUPER | New fine etching control system |
Etching Materials 《Etchants》
| PRODUCT NAME | USE | Target metal |
|---|---|---|
| ADEKA CHELUMICA FE series | PWB,FPC,TAB,BGA,lead frame | Cu, Copper alloys |
| ADEKA CHELUMICA TFE-3000 series | COF,FPC | Cu |
| ADEKA CHELUMICA TFE-5000 series | IC package substrate, next generation printed substrate | Cu |
| ADEKA CHELUMICA ST series | Encoder, hard disk drive suspension | Stainless |
| ADEKA CHELUMICA AL series | IC card, IC tag, power module substrate | Aluminum |
| ADEKA CHELUMICA ITO series | Pull-out wiring formation of capacitance type touch panel | ITO＋Metal |
| ADEKA CHELUMICA MSE series | Metal wiring formation, and viewing area removal of capacitance type touch panel | Cu system, Ag system |
| ADEKA CHELUMICA GA series | Etchant for TFT-ARRAY wiring | Cu, Ti, Mo, CuNi |
| ADEKA CHELUMICA AD series | Flash etchant for semi-additive process | Cu |
| ADEKA CHELUMICA LAD series | Etchant regenerant |
Etching Materials 《Selective Etchants》
| PRODUCT NAME | USE | Target metal |
|---|---|---|
| ADEKA CHELUMICA W series | Electronic parts, MEMS, WLP | Cu system, Cr system, PZT system |
| ADEKA TEC W series | Electronic parts, MEMS, WLP | TI system, W system, Ni system, Mo system |
Metal Surface Treatment Agents《Surface Treatment Agents》
| PRODUCT NAME | USE | Target metal |
|---|---|---|
| ADEKA CLEANER Ｃ series | Chemical abrasive agent for TAB/COF/PWB | Cu |
| ADEKA CLEANER MS series | Chemical abrasives for stainless and 42 alloy | Stainless, 42 alloy |
| ADEKA REMOVER NR series | Ni-Cr seed layer remover | Ni-Cr |
| ADEKA TEC A series | Soft etchant for copper surface | Cu |
| ADEKA TEC CL series | Anti-chlorine soft etchant for copper surface | Cu |
| ADEKA TEC CAP series | Chemical abrasives for copper and copper alloys | Cu, copper alloys |
| ADEKA TEC S series | Surface roughening agent for copper | Cu |
| ADEKA TEC JC series | Copper stripper for plating jig | Cu |
Metal Surface Treatment Agents《Remover For Hard Coating Metals》
| PRODUCT NAME | USE | Target metal |
|---|---|---|
| TITAPEEL A/B series | Remover for Ti system hard coating metals | TI system |
| TITAPEEL CR series | Remover for Cr system hard coating metals | Cr system |
Functional Agents 《Cleaning Agemts for Manufacturing Process》
| PRODUCT NAME | USE |
|---|---|
| ADEKA TEC ND series | Dry film resist-developer tank cleaner/stripping tank cleaner, solder resist-stripping tank cleaner |
| ADEKA CLEANER EC series | Etcher cleaner (Si oxide sludge cleaner) |
Functional Agents 《Resist Stripper Agents》
| PRODUCT NAME | USE |
|---|---|
| ADEKA REMOVER RA series | Anti-metallic corrosive resist stripper |
| ADEKA REMOVER R series | Dry film resist, ED resist stripper |
Sheet Materials for Packaging
| PRODUCT NAME | USE |
|---|---|
| ADEKA FILTERA BUR-2000 series | Insulation bonding sheet for super-high multi-layer boards |
| ADEKA FILTERA BUR-5000 series | Thermal release bonding sheet for LEDs and power semiconductors |
| ADEKA FILTERA BUR-6000 series | Thermal release bonding sheet for power LEDs and SiC semiconductors |