Copper paste
Next-generation semiconductors require heat resistance, heat dissipation, and high reliability for higher integration and output. Our copper paste is a resin-containing Cu paste that can provide excellent performance such as low resistance, high heat dissipation, and high adhesion to metals. Our unique special formula prevents oxidation during curing and sinters at 200°C or higher. Our lineup of products includes air/inert gas curing conditions, pressure/no pressure processing conditions, and solvent/solvent-free types, depending on the material design. Depending on the series, low resistance, low temperature sintering, and high heat dissipation are possible. Compared to solder, it has high heat resistance and reliability, and while maintaining the same electrical properties as silver paste, it can reduce ion migration, making it a promising alternative.
Air/No pressurization：ADEKA ORCERA SLDP series
Inert gas/No pressurization：ADEKA ORCERA MDP series
Inert gas/Pressurization：ADEKA ORCERA TDP series
Applications
- SLDP series：External electrode for electronic components, etc.
- MDP series：Substrate via connection, Die bonding, Component mounting, etc.
- TDP series：TIM for semiconductor packages, Power device chip bonding
Features
- SLDP series：Can be cured in air
- MDP series：Further lower resistance possible under inert environment
- TDP series：Has high thermal conductivity under pressurized environment
| Unit | SLDP series | MDP series | TDP series | |
|---|---|---|---|---|
| Cure condition | ─ | Air | N2, Ar etc | N2, Ar |
| Process condition | ─ | No pressurization | No pressurization | Pressurization |
| Viscosity | Pa・s | 10～30 | 20～40 | 10～30 |
| Volume resistance* | Ω･cm | 3.0×10-5< | 2.0×10-5< | 1.0×10-5< |
| Thermal conductivity** | W/m･K | 20 | 30< | 50< |
| Modulus | GPa | 7-8 | 13-20 | 15-20 |
*250℃×30min
**200℃×60min×Vacuum hot press