Surface treatment agent for copper
Our surface treatment agents for copper can improve adhesion between copper and DFR by roughening copper surface. Additionally, It can be used as pre-treatment for plating process.
TEC CL-8・TEC CAP
Applications
DFR and SR lamination pre-treatment,
Pre-treatment for plating, Half etching
Features
- Hydrogen peroxide-based surface treatment agent
- Can be used with tap water (chlorine ion concentration 30ppm or less)
- Etching rate and roughness can be adjusted by mixing ratio
- When used as a pre-treatment for gold plating process, it smooths gold surface
- Less under cut between substrate and copper foil and better adhesiveness between copper and DFR than conventional products
