Metal selective etchant
Our metal selective etchants have excellent metal selectivity and can selectively remove layered silver or nickel without attacking copper. These etchants are hydrogen peroxide-based solutions and can be used either by spray or by dipping.
Ag etchant：ADEKA CHELUMICA SVE series
Applications
Wiring formation for various electronic components
Features
- Can remove Ag thin film, Ag nanowires, and Ag nanoparticles without leaving any residue
- High control of width loss in Ag wiring
Ni etchant：ADEKA CHELUMICA DH series
Applications
Wiring formation for various electronic components
Features
- Can selectively remove Ni and Ni alloys
- Maintains the luster of the Cu surface
- Suppresses galvanic corrosion
| SVE series | DH series | |
|---|---|---|
| Target metal | Ag | Ni |
| Liquid property | Weakly acidic | Acidic |
| E.R. | 400nm/min. | 1.9μm/min. |
| Cu E.R. | 45nm/min. | 0.1μm/min. |