Non-roughening adhesion improver for high frequency applications
In order to realize next-generation high-speed communications that use high-frequency bands, it is essential to reduce the transmission loss of the constituent materials. Generally, the copper surface needs to be roughened to ensure adhesion between the copper and resin, but our non-roughening adhesion improver improves the adhesion between the copper and resin without roughening the copper surface, making it possible to reduce transmission loss. In addition, because of non-roughening, there is no reduction in the copper film thickness, therefore fine pitch patterning is expected.
STA series
Applications
FC-BGA, Multilayer substrate, etc.
Features
- Adhere to resin without roughening copper surface
- High stability as it is a water-based treatment agent
- No need for heat treatment
