Cu etchant for subtractive process
Our Cu etchant for subtractive process enables stable etching by using the automatic control equipment “AFES controller”. In order to maintain a constant concentration of the etching solution, it automatically analyzes the etching solution at all times and automatically replenishes etching make-up solution and water according to the ORP (oxidation-reduction potential), ion index (free acid concentration) and specific gravity. This results in stable production of fine patterns, a significant reduction in defective rates, and improved productivity. Additionally, it is possible to control the hydrochloric acid concentration at 0.6% or less.
Applications
PCB, Lead frame, VCM spring
Features
- Etching rate: Approx. 1.5 times higher than copper (II) chloride solution / Approx. 1.2 times higher than ferric chloride solution
- Etching factor: Approx. 30% improvement compared to ferric chloride solution
- The amount of copper dissolved is approximately 90g/L, which is higher than that of ferric chloride solution, allowing for reductions in usage and waste liquid volume
- Compatible with fine wiring
