Resin Materials for Semiconductor Back-End Process
Thermal conductive insulation sheet for power modules and TIM
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Our thermal conductive insulation sheets are designed with a compound based on our own epoxy resins, etc., and have high heat resistance with a Tg exceeding 300℃.
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Thermal conductivities 13W/m・K：TG-33
Bonding sheet
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Our bonding sheet can be used for semiconductor package substrate, interposer, and multilayer substrate.
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Bonding sheet