It Related Materials

Our thermal conductive insulation sheets are designed with a compound based on our own epoxy resins, etc., and have high heat resistance with a Tg exceeding 300°C. In addition, by applying our unique surface treatment technology to the heat dissipation filler, we have achieved heat dissipation with a thermal conductivity of 13W/m・K , insulation with a withstand voltage of 6kV, and excellent reliability in high temperature and high humidity environments. Our sheet has the high heat resistance, high heat dissipation, and insulation properties necessary to bring out the performance of wide band gap semiconductors such as SiC and GaN. For TIM applications, organic resin bonding is expected to suppress cracks during thermal cycles.