Bonding sheet
Our bonding sheet can be used for semiconductor package substrate, interposer, and multilayer substrate.
Applications
FC-BGA, Interposer, Multilayer substrate, etc.
Features
- Strong adhesiveness with various base materials (CCL, copper foil, glass, etc.)
- Low warpage, narrow gap embedding, unevenness followability
- Good moisture resistance reliability (HAST)
| Condition | Unit | A-22 | |
|---|---|---|---|
| Tg | TMA | ℃ | 174 |
| CTE | TMA，40～150℃ | ppm | 27 |
| Modulus | JIS K7162-5A | GPa | 11 |
| Dk | 10GHz | ― | 3.19 |
| Df | 10GHz | ― | 0.0078 |
| Peel strength (Cu, Glass) |
JIS C6481 | kN/m | 1.4< |
| Surface resistance | C-96/20/65 +D-2/100 |
Ω | 1E+13< |