menu

Chemical Products

What's New

To Join IMAPS Device Packaging conference 2026

Feb. 04, 2026

ADEKA CORPORATION and its U.S. subsidiary, ADEKA USA Corporation, will exhibit at the "IMAPS Device Packaging Conference 2026," which will be held in Arizona, USA, starting March 2, 2026.
We look forward to welcoming you at our booth.

[Exhibition Information]

1. Date

March 2-5, 2026
Technical Sessions: March 3-5
Professional Development Courses (PDC): March 2
Exhibition: March 3-4

2. Venue

The Sheraton Grand at Wild Horse Pass (Arizona, USA)

3. Booth Number

507

4. Exhibited &
  Development Products

Semiconductor Back-end Materials

  • High heat-resistance, high heat-dissipation insulating adhesive sheet
  • Low-temperature sintering copper paste
  • Seed layer etchant
  • Non-roughened adhesion promoter

Automotive & Electronic Component Materials

  • Ultra-fast curing adhesive (laser bonding)
  • Secondary assembly underfill / side-fill materials

5. Organizer

International Microelectronics Assembly and Packaging Society

6. Official Website

https://imaps.org/page/device-packaging-conference

CONTACT

to Pagetop