ADEKA's New Core R&D Facility, The Semiconductor Innovation Center, Begins Full Operations
～Toward a Leading Comprehensive Semiconductor Materials Manufacturer～
Jul. 02, 2026
ADEKA CORPORATION today announced the full-scale launch of the Semiconductor Innovation Center in Kuki, Saitama.
Semiconductors have become strategic technologies worldwide, with the market projected to reach USD 1.5 trillion by 2026. Japan remains highly competitive in semiconductor manufacturing through its strengths in equipment and materials, with Japanese companies accounting for more than half of the global semiconductor materials market. Growing demand from AI and data centers is driving the need for faster information processing and lower power consumption. This is driving innovation in semiconductor technologies, including higher integration and advanced packaging, and creating demand for a game change across the semiconductor supply chain.
ADEKA provides key materials for advanced semiconductors, including High-k Materials (ALD Precursors) used in deposition processes, Photoacid Generators for Chemically Amplified Resists (CAR) , and Organometallic Compounds for Metal Oxide Resists (MOR) used in advanced lithography.
The business is a key profit center for ADEKA, backed by approximately ¥52.1 billion invested in R&D, production capacity, and talent development over the past five years.
The Center serves as ADEKA’s core R&D hub, integrating and expanding semiconductor materials and advanced packaging research functions previously based in Arakawa-ku, Tokyo. The R&D area has been expanded to 2.7 times its previous size. The Center features an over 850m² single-floor cleanroom, equipped with multiple ALD systems and evaluation tools. Working with its bases in Japan, South Korea, Taiwan, and the U.S., ADEKA will strengthen its front-end materials business while expanding into new materials for advanced packaging, enabling faster responses to customer needs worldwide.
The Center will serve as a strategic hub for expanding ADEKA’s semiconductor materials business through continued investment in personnel, R&D, and production capacity. By FY2035, ADEKA aims to generate ¥32.5 billion in operating profit from this business--more than 40% of the Company’s total operating profit--and become a comprehensive semiconductor materials manufacturer.
Outline
Name |
ADEKA Semiconductor Innovation Center |
|---|---|
Location |
20 Showanuma, Shobu-machi, Kuki City, Saitama |
Investment |
Approximately ¥12 billion |
Scale |
7-story steel-frame building
|
Main Facilities |
Laboratories, Cleanroom, Analytical Labs, Meeting Rooms, etc. |
Constructor |
OBAYASHI CORPORATION |
Schedule |
Construction Start: Apr. 2024 |
No. of Researchers |
Approximately 150 (as of Jul. 1, 2026) |
Key Development Themes
ADEKA’s strengths in ALD Precursors and Semiconductor Lithography Materials have contributed primarily to semiconductor scaling in front-end processes. Going forward, structural changes in advanced devices--including HBM, Advanced Logic ICs, Backside Power Delivery, and advanced packaging technologies such as CoWoS--will require a game change in back-end materials. By leveraging its expertise in ALD Precursors, Specialty Resins, Surfactants, and other technologies developed for electronics and mobility applications, ADEKA will expand into new materials for advanced packaging and accelerate its transformation into a comprehensive semiconductor materials manufacturer.
Front-End Processes
Deposition |
＜Enhanced＞ALD Materials...High-k / Low-k Materials, Peripheral Materials
|
|---|---|
Lithography |
＜Enhanced＞PAGs for CAR, Organometallic Compounds for MOR
|
Etching |
＜Next-Generation＞ALE Materials, etc. |
Back-End Processes＜Next-Generation＞
Thermals |
Thermal Interface Sheets, Sintered Copper Paste |
|---|---|
Plating |
Conductive Copper Paste, Copper Complex Inks, etc. |
Bonding / |
Adhesives for Hybrid Bonding, Encapsulation Materials,
|
For further information, please refer to the news release and media briefing presentation materials below.