Electronic circuit board manufacturing technology advances daily. Etching agents are also required to deliver advanced performance. We are working to develop a succession of etching agents for next-generation technologies, and to move into new product fields.
Department: INFORMATION & ELECTRONIC MATERIALS DEPARTMENT
Section: CIRCUIT MATERIALS GROUP
"ADEKA AFES SYSTEM" is an automatic controller that regularly analyzes etching solutions and automatically feeds separately-prepared reactivating agents and water in necessary quantities based on ORP (oxidation-reduction potential), ion index (concentration of free hydrochloric acids) and specific gravity. This offers the user a number of positive outcomes including stable production of fine patterns and marked improvements in yields, etc.
|ADEKA AFES SYSTEM||Fine etching control system|
|ADEKA CHELUMICA FE-200||PWB, FPC, TAB, Lead frame (Copper alloy) etchant|
|ADEKA CHELUMICA ST-448/548||Chemical milling (Stainless steel) etchant|
|ADEKA CHELUMICA AL-series||RFID, IC card, and Power Module Substrate (Aluminium) etchant|
|ADEKA CHELUMICA LAD-100||Copper, Stainless steel, Aluminium etchant regenerator|
|ADEKA CHELUMICA ITO-series||LCD, PDP and Touch Panel (ITO elctrodes) etchant|
TFE-Series are an epoch-making and new etchant for fine pattern etching.
This new etchant offers a breakthrough in subtractive etching process.
|ADEKA AFES SUPER SYSTEM||New fine etching control system|
|ADEKA CHELUMICA TFE-3000 series||Etching applocation:COF|
|ADEKA CHELUMICA TFE-5000 series||Etching applocation:IC package substrate|
|ADEKA REMOVER NR-series||Ni-Cr seed removal agent|
|ADEKA CHELUMICA AD-series||Semi-additive etchant|
|ADEKA CHELUMICA W-series||Wafer level CSP etchant|
Among our functional products are metal surface treatment agents for electronic components and stabilizers for alkaline hydrogen peroxide solution.
|ADEKA TEC ND-series||Cleaning agent for DFR develping equipments.|
|ADEKA TEC CL/A-series||Surface treatment and electronic components. Micro-etching chemical for copper.|
|ADEKA TEC CAP||Polishing agent for copper/copper alloy chemical.|
|ADEKA TEC JC||Stabilizers for metal surface treatment and electronic components.|
|ADEKA TEC SO/S-series||Micro-etchant for pretreatment PR or Tin plating.|
We produce high-purity Hydrogen peroxide, used in the manufacture of electronic and semiconductor devices and silicon wafers, from industrial Hydrogen peroxide in a continuous process, entirely within one factory site. Our stringent quality control system delivers a stable supply of dependable high-purity Hydrogen peroxide.
|ADEKA SUPER EL/HP||Agent for wafer-preparation process,device-fabrication process etc.|
There was a time, starting at the beginning of printed circuit boards for industrial applications, in which ammonium persulfate, a base, was used as the etching agent. Outside electronics-related fields, sodium and potassium persulfate were widely used in fields such as chemicals and fibers.
|AMMONIUM PERSULFATE||Printed circuit boards, Metal surface treatment, Chemicals, Fibers, etc.|